applicants
Wire Bond Staff Engineer
at ashley in KL
The company is a leading service provider of semiconductor packaging design, bump, probe, assembly, test and distribution solutions. They provide fully integrated, multi-site, end-to-end packaging and testing solutions that bring products to the market faster.
Responsibilities:
•Lead a group of wirebond engineers work toward characterize wire bond process, capillary selection, qualification, and UPH improvement
•Able to lead, grow and coach engineers on problem solving skill, communication, cost saving project implementation and breakthrough invention on wire bond process
•Involve in receiving product/technology transfer from NPI to ensure a flawless HVM startup
•Improve and sustain process yield, drive process restoration, resolve daily bondability issues, equipment sustaining, process performance monitoring, production quality investigation, product failure analysis, and dealing process deviation
•Benchmark of process technology and best practices
•Take lead on cost saving projects to achieve lean six sigma and operation excellence.
Requirements:
•Must possess a Degree in Engineering with more than 5 years of wire bond experience
•Strong statistical analysis and problem solving skills.
•Strong communication skills both written and oral
•Cu WB is added advantage
*Only for Malaysian applicants
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